Canon-machinery SCW1 晶圆图像炉
时间：2017-06-29 阅读：265
Canon-machinery SCW1 晶圆图像炉
BEST TCO
High UPH, Small Foot Print, Minimized Conversion
Best Quality
High Accuracy XY: 38μm(3σ)
Countermeasure for Fragile devices
Ex, IR cut Filter, other transparent glass
Defective Chip Inspection
Capable of backside inspection
Flexible Die P/U Capability
□1.0～12.5mm with high quality
| Target Device | Si,Glass |
|---|---|
| Cycle time | 0.38sec/cycle |
| Arrangement accuracy | XY: 38μm,3σ |
| Die size | □1.0～□12.5mm t=0.1～1.0mm |
| Tray size | 2/3/4 inch |
| Tray thickness | 2～8mm |
| Ring size | Max 8-inch |
| Tray size conversion time | 12 minites |
| Tray stock size | MAX:250mm |
| Loader | Tray stacking system |
| Unloader | Pallet system |
| Recognition system | Pocket recognition(CMOS camera) |
| Inspection system | Visual inspection system(Option) |
| Power requirement | Power supply:AC200V 20A Dry air:0.4MPa(60L/min) Vacuum:-66.7KPa(100L/min) |
| Weight | 1,200 kg |