Besi Esec 2009 SSIE 芯片焊接机
 

The new Esec Die Bonder 2009 SSI^E is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Esec Die Bonder 2009 SSI^Eensures your leading market position.

The 2009 SSI^E is the only softsolder bonder in the market able to handle 300mm / 12" wafers (optional).

Highest Speed

• New point to line pick & place
• High speed high accuracy dispensing technology
   

Best Process Quality

• Lowest gas consumption
• Patented dispensing and bonding technology
• Process visualization
   

Widest Application Range

• Solution to handle the ultra thin and ultra wide leadframes
• Solution to process power modules
   

Fastest Time to Yield

• Fast product change over with exchangeable indexer
• User friendly menu structure
• Easy to use mechanical design
   

Co-Development

• Involve in power package design
• Work closely together with customers and suppliers
   

Ready for the Future

• Expandable machine design
• Multi process capability
• Ultra thin die handling
• Net productivity2,500 to 8,000 UPH typicalTypical bonding accuracy (product dependent)60µm @ 3σ
  with optical bond centering option: 50µm @ 3σSolder wire spoolsDiameter: max. 155 mm / 6.1”
  Width: max. 12 mm / 0.47”
  Mounting hole: 8 mm to 10.5 mm / 0.31” to 0.41”Wafer sizeUp to 8"
  12" optionalDie size1 x 1 mm to 11 x 11 mm
  40 x 40 mils to 430 x 430 milsMachine dimensions1,970 x 1,305 x 1,760 mm (W x D x H)

Handling

• Magazine Handler Input
• Magazine Handler Output
• Top Stack Loader Wide
• Dual Input Handler
• Dual Power Leadframe Loader
• Dual Power Leadframe Loader 2
• Stack Power
• Power Marker Unit
• Single Wafer Loader
   

Dispenser

• Programmable Dual Wire Dispenser
• Programmable Pre Press Module
   

Vision

• Prog. Quality Control evision
• Optical Bond Centering (OBC)
• Pre-bond Vision Inspection (Pre-IQC)
• Post-bond Vision Inspection (Post-IQC)
   

Miscellaneous Options / Special Applications

• Advanced Thin Die
• Thin Die Pick-up
• Thin Die Pick-up Flexible
• Small Die Kit / Ultra Small Die Kit
• Leadframe Identification
• Uninterruptible Power Supply
• Heated Pepper Pot
• Gas Supply Feature
• Wafer Mapping Package (WMP4, incl. conversion package)
• Host Package 
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