Ultra-high performance FIB

• Low CsFIB optics^（*2） deliver 50nA or more of beam current （@40kV） in an about 1µm spot-size. The high current enables unconventional large-area milling, hard material fabrication and high throughput multiple specimen preparation.

New Micro-sampling

• Hitachi's patented Micro-sampling technology provides smooth probe motion. Also, the probe can be used for newly developed absorbed current imaging^（*1） to aid fault isolation.

High precision end-point detection

• High resolution SEM allows high precision end-point detection. Section-view function, which displays an outline of the cross-section utilizing the real-time FIB image, is ideal for preparing electron irradiation sensitive specimens like low-K material.

High resolution SEM

• Hitachi's unparalleled SEM column and detector design^（*2） enables high resolution SEM imaging during and after FIB fabrication.

Holder compatibility with TEM/STEM^{（*1）（*2）}

• A side entry STEM/TEM-type staqe^（*1） allows the use of the same specimen holder （compatible with NB5000 and Hitachi TEM/STEM）. No tweezer handling of specimen during transfer results in higher throughput TEM/STEM analysis.

^（*1）:Optional accessory
^（*2）:Hitachi patent
Low Cs FIB optics: patent pending, Micro-sampling: JP2774884/US5270552, Section-view function: patent pending, SEM column and detector design: JP3081393/US5387793, Holder compatibility: JP2842083

聚焦离子束 电子束装置NB5000 Specifications

CP:Beam Cross Point

^（*1）:Optional accessory
^（*2）:When side entry stage is ordered