M-BOND™ 610 Adhesive
This is a non-conductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.
Operating temperature range, short term is -269° to +370°C; long term, -269° to +260°C.
Elongation can occur at +24°C （3%）. This may be the widest temperature range general-purpose adhesive that is available.
A kit contains: 4 bottles （14g each） Resin, 4 bottles （11g each） Curing Agent, 4 brush caps for dispensing mixed adhesives, 4 disposable mixing funnels and instructions.

这是一种非导电的双组分溶剂稀释环氧酚醛粘合剂，适用于高性能应用。 耐化学腐蚀，并提供一层薄薄的胶水，具有良好的离子研磨性能。 它具有低粘度且极薄，具有小的蠕变，滞后和线性问题。 固体含量为22％。 它是一种*的粘合剂，用于安装样品，用于TEM浸渍和样品与TEM网格的粘接，用于成像或FIB。
工作温度范围，短期为-269°至+ 370°C; 长期，-269°至+ 260°C。
伸长率可在+ 24°C（3％）下进行。 这可以是可用的宽温度范围的通用粘合剂。
套件包含：4瓶（每瓶14克）树脂，4瓶（每瓶11克）固化剂，4个用于分配混合粘合剂的刷帽，4个一次性混合漏斗和说明书。

M-BOND™ 610 Adhesive
 

M-BOND™ 610 Adhesive