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PN | DESCRIPTION | ADHESION (1) | ADHESION (2) |
1020R | Ultraviolet Film (PVC), 95 microns thick (3.8 mils), supplied in 100 meter (330') rolls with backing (typical use - wafer backgrinding or dicing) (Note: very high Adhesive Strength to begin with, desirable for dicing operations, then reduces to a very low Adhesive Strength level after exposure to UV light, ideal for pick and place operations) | @30 mins (Si) 375/20* @24 hours (Si) 308/14* | @30 mins (Si) 320/15* @24 hours (Si) 247/12* |
1027R | Super-High Tack Anti-static Ultraviolet Film (Poly Olefin) of 175 microns thick in 100 meter (330') rolls with PET backing (typical use is for backgrinding or dicing) | @30 mins (Si) 1850/28* @24 hours (Si) 1980/33* | @30 mins (Si)2080/28* @24 hours (Si)2160/33* |
1042R | Anti-static Ultraviolet Film (Poly Olefin) of 98 microns thick in 100 meter (330') rolls with Polyester backing (typical use is for thin wafer dicing) | @30 mins (Si) 300/25* @24 hours (Si) 550/28* | @30 mins (Si) 300/10* @24 hours (Si) 600/10* |
1043R | Anti-static Ultraviolet Film (Poly Olefin) of 168 microns thick in 100 meter (330') rolls with Polyester backing (typical use is for thin wafer dicing) | @30 mins (Si) 890/20* @24 hours (Si) 1042/60* | @30 mins (Si)1035/15* @24 hours (Si)1105/28* |
1044R | Anti-static Ultraviolet Film (Poly Olefin) of 268 microns thick in 100 meter (330') rolls with Polyester backing (typical use is for thin wafer dicing) | @30 mins (Si) 350/29* @24 hours (Si) 650/35* | @30 mins (Si) 400/15* @24 hours (Si) 700/15* |
(1) adhesion is measured at 30 minutes and 24hours after application to Stainless Steel, using grams per 25 mm width
(2) adhesion is measured at 30 minutes and 24hours after application to Silicon Wafer, using grams per 25 mm width
*These numbers are before curing adhesive levels/after curing adhesive levels.