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ESDEMC ES612A ESD TESTER (HBM, HMM, MM)

型号
ESDEMC
参数
应用领域:电子,航天,汽车,电气,综合
湖南格雷柏电子科技有限公司

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ES612A ESD测试仪(HBM、HMM、MM)

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HBM(HMM,MM)测试仪

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ES622系列TLP脉冲IV曲线系统 ,HBM/MM/Latch-up测试机, ESD/CDM/Latch-UP抗静电能力测试系统, ES612A 静电测试仪(HBM、HMM、MM), ESD静电和闩锁测试系统, CDM充电器件模型测试仪, CDM测试机, 半导体器件静电测试仪, 晶圆级ESD测试仪,EMI近场测试扫描仪系统

      湖南格雷柏电子科技有限公司成立于2016年,主要代理销售国内外产品,致力于表面科学、电子电力、环境力学、化学分析、可靠性分析等领域检测仪器仪表、设备和配件综合服务供应商。

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详细信息

ES612A ESD TESTER (HBM, HMM, MM)

1. Description

The model ES612A ESD Tester is a 2-Pin tester designed for the evaluation of devices at both wafer level and package level. The tester is designed to carry HBM, HMM and MM ESD standards. Determination of ESD failure thresholds is made easy using one of the external DC characterization measurement capabilities. The unit can be expanded with our automatic multi-pin device tester and be used as part of your device qualification process.

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

2. Features

  • Low Parasitic HBM/HMM/MM 2-pin tester with high quality pulses

  • Very configurable and expandable

  • Friendly for probe station

  • Automatic External Module Detection

  • Large Touch Panel and Firmware Upgradable

  • Optional Software Controlled Automated Pulse and Failure Measurement

  • Optional Pulsed IV and DC IV Characterization

3. Applications

  • General device level ESD test for wafer, packaged, PCB and system devices

  • HBM module meets ANSI/ESDA/JEDEC JS-001, MIL-STD-883, AEC-Q-101-001 and MIL-STD-750

  • HMM module meets ANSI/ESD SP5.6, 50 Ohm Method

  • MM module meets ANSI/ESD STM5.2

4. Specifications

ES612A Controller Options

Parameters ES612A-2K ES612A-4K ES612A-6K ES612A-8K ES612A-12K ES612A-20K ES612A-30K Unit
Output voltage ± 10 ~ 2k ± 10 ~ 4k ± 10 ~ 6k ± 10 ~8k ± 10 ~ 12k ± 10 ~ 20k ± 10 ~ 30k V
Output voltage step 1V up to 500V, 10V up to max voltage  
Output voltage precision Better than ± 1 % ± 5 V  
Dimensions 347 X 300 X 145 mm
Weight 5 6 6 6 6 7 8 kg
V and I Measurement Passive voltage and current probes  
Supported Oscilloscopes Majority models from Keysight, Tektronix, LeCroy.  
Supported SMU Keysight 2900 Series, Keithley 24xx/26xx series SMU.  

HBM External Human Body Model Module

(Per ANSI/ESDA/JEDEC JS-001)

Parameters HBM-2K HBM-4K HBM-6K HBM-8K HBM-12K HBM-20K HBM-30K Unit
Output voltage ± 10 ~ 2k ± 10 ~ 4k ± 10 ~ 6k ± 10 ~8k ± 10 ~ 12k ± 10 ~ 20k ± 10 ~ 30k V
Discharge RC Value C: 100 pF ± 10%, R: 1.5kΩ ± 1%  
Short Load Peak Current Ips 0.67A ± 10 % per kV A
Short Load Rise Time Trs 2 < Trs < 10 ns
Short Load Decay Time Tds 130 < Tds < 170 ns
Short Load Ringing Irs < 15% of Ips  
500  Load Peak Current Ipr Ipr/Ips ≥ 63%  
500  Load Rise Time Trr 5 < Trr < 25 ns

HMM External Human Metal Model Module
(
Per ANSI/ESD SP5.6)

Parameters HMM-12K HMM-24K HMM-36K Unit Comments
HMM first peak current 45 90 135 A 3.75 A per 1 kV ≤ ± 10 %

 

IEC 61000-4-2 (R=330Ω, C=150pF)

HMM current @ 30 ns 24 48 72 A ≤ ± 10 % (better than ±30% IEC )
HMM current @ 60 ns 12 24 36 A ≤ ± 10 % (better than ±30% IEC )

 MM External Machine Model Module

(Per ANSI/ESD STM5.2)

Parameters MM-2 MM-4 Unit Comments
Output Voltage ±10 ~ 2000 ±10 ~ 4000 V  
Discharge RC Value C: 200 pF, R: 0 Ω    
Short Load Peak Current Ip1 1.75±10% per 100V A Waveforms above 3kV will no longer exhibit linear increase. Tolerance may
be different if socket is used
Short Load Ip2 67% ~ 90% of Ip1 A
Short Load Pulse Period tpm 66 < tpm < 90 ns
500 Ω Load Peak Current Ipr 0.85 – 1.2 A @400V condition per standard
500 Ω Load I100 0.23 – 0.4 A @400V condition per standard
500 Ω Load I200 30 -50% of measured I100 A  

ES612-SIVI Tester Integrated Static IV Module

Parameters ES612-SIVI Unit Comments
Source Voltage 0 ~ ±40 V  
Min Step Size 0.1 V  
Accuracy ±1%±50mV   Tolerance maybe different
Max Source Current 100 mA  
Measured Current Accuracy ±1%±40nA    

5. Ordering Information

Line Part # or Option # Description
ESD Tester
1.1 ES612A-2K ES612 ESD Tester, Max 2kV, USB Supported
  ES612A-4K ES612 ESD Tester, Max 4kV, USB Supported
  ES612A-6K ES612 ESD Tester, Max 6kV, USB Supported
  ES612A-8K ES612 ESD Tester, Max 8kV, USB Supported
  ES612A-12K ES612 ESD Tester, Max 12kV, USB Supported
  ES612-20K ES612 ESD Tester, Max 20kV, USB Supported
  ES612-30K ES612 ESD Tester, Max 30kV, USB Supported
1.2 ES612A-HBM-2 Human Body Model 2 Pin Module, 2kV
  ES612A-HBM-4 Human Body Model 2 Pin Module, 4kV
  ES612A-HBM-6 Human Body Model 2 Pin Module, 6kV
  ES612A-HBM-8 Human Body Model 2 Pin Module, 8kV
  ES612A-HBM-12 Human Body Model 2 Pin Module, 12kV
  ES612A-HBM-20 Human Body Model 2 Pin Module, 20kV
  ES612A-HBM-30 Human Body Model 2 Pin Module, 30kV
1.3 ES612A-HMM-12 Human Metal Model 2 Pin Module, 12kV equivalent HMM
  ES612A-HMM-24 Human Metal Model 2 Pin Module, 24kV equivalent HMM
  ES612A-HMM-36 Human Metal Model 2 Pin Module, 36kV equivalent HMM
1.4 ES612A-MM-2 Machine Model 2 Pin Tester Module, 2kV
  ES612A-MM-4 Machine Model 2 Pin Tester Module, 4kV
1.5 ES612-SIVI Tester Integrated Static IV Module (Allow DUT failure check without SMU or PC)
Accessories
2.1 CT-T03-1p0 Current Probe 2kHz to 2 GHz, 1 V/A (Better than Tektronix CT1 & CT2)
2.2 HBM-BA1 HBM Board Level Test Accessories Set, Including Cables, Adapters, Calibration Kit and Current Probe
2.3 MM-BA1 MM Board Level Test Accessories Set, Including Cables, Adapters, Calibration Kit and Current Probe
2.4 ES612A-HBM-WA1 ES612A HBM or MM Wafer Level Test Accessories Set, Including Probe Arms, Needles, and Micro-positioners
2.5 ES612A-HMM-WA1 ES612A HMM Wafer Level Test Accessories Set, Including Probe Arms, Needles, and Micro-positioners
2.6 CMPS-200A Compact Manual Probe Station
2.7 HBM-TC0.3 0.3 mm Pitch Test Clip for Packaged IC Probe
2.8 XYZM-PP048 0.48 mm Pogopin for package level test (pack of 20)
2.9 XYZM-TN1 Tungsten Needles – 5 mils sharp tip, for wafer level test (pack of 10)
Third Party
3.1 KSMU2450 SMU, 200V, 1A, 20W, Single Channel (For device DC automation failure check))
3.2 MISC-OSC-1G 1 GHz BandWidth, 5Gs/S, 4Ch Oscilloscope
3.3 MISC-OSC-200M 200 MHz BandWidth, 2Gs/S, 4Ch Oscilloscope
3.4 MISC-OSC-350M 350 MHz BandWidth, 2Gs/S, 4Ch Oscilloscope
Automation Solution
4.1 HBM-RE64X2 64 Pin Relay Expansion Module for HBM Automation
4.2 HBM-RE128X2 128 Pin Relay Expansion Module for HBM Automation
4.3 HBM-RE256X2 256 Pin Relay Expansion Module for HBM Automation (Obsoleted)
4.4 ES62X-PC-SW1 PC included Automation Software for 2-Pin, Pulse & SMU
4.5 ES62X-PC-SW2 PC included Automation Software for 2-Pin, Pulse, OSC & SMU
4.6 ES62X-PC-SW3 PC included Automation Software for Expansion Module 1 pulse to 1 GND pin test, Pulse, OSC & SMU
4.7 ES62X-PC-SW4 PC included Automation Software for Expansion Module 1 pulse to multi GND pins test, Pulse, OSC & SMU
4.8 ES650-150 Full Automation 2 Pin Low Parasitic Robotic Automaton Solution

(Unlimited Pin, no need of PCB, PC & full-automation software Included)

 

ES612A ESD TESTER (HBM, HMM, MM)

 

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应用领域 电子,航天,汽车,电气,综合
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