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Besi FicoAMS-LMTopFoil芯片成型系统

时间:2017-08-12      阅读:1078

Besi Fico AMS-LM Top Foil 芯片成型系统
 

In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine with Top Foil functionality, to mold single sided MAP products like BGA, QFN and BOC. The unique Top Foil feature on this machine allows bleed free production of bare die products.

Top Foil

A special foil, guided over the top mold, creates a soft sealing layer between mold and products. As a result, the die stays clear of compound. The use of top foil eliminates an extra cleaning process step after molding. The Fico AMS-LM Top Foil can handle substrates of up to 102 x 280 mm and can handle all current single sided packages.

More information?

Curious of what the Fico AMS-LM with Top Foil can do for you? Contact the Besi sales department for more information.

Cassette Handler

  • High capacity
  • Freely accessible
  • Slot to slot copy
  • Two or four deck version
  • Bar code and RFID reader (optional)
     

Vision

  • Leadframe orientation check
  • Mark inspection
  • Optical Character Verification (OCV)
     

Leadframe Handler

  • Automatic orientation correction
  • Leadframe pre-heating
  • Anti warpage leadframe cooling
  • Air cushion transport
     

Molding Press

  • Large substrate molding
  • Top Foil
  • Topedge molding (low viscosity compounds)
  • Adjustable high clamping force
  • Dynamic Clamping Control (Flip Chip Bare Die)
  • 17 process patents
  • Board and cavity vacuum
  • Individual, equal board clamping
     

Pellet Supply

  • Remote pellet feed (up to 40m)
  • Pellet length check
  • Pellet cooling
  • Pellet age control
  • Width3,145 mm
    Depth1,652 mm
    Height1,976 mm
    WeightApprox. 3,450 kg

     

    Leadframe Dimensions

    Width72 -102 mm
    Length100 - 280 mm
    Thickness0.1 - 1.5 mm
    Heightmax. 2 mm

     

    Cassette Dimensions

    Width80 - 120 mm
    Length180 - 300 mm
    Height100 - 165 mm
    Storage capacity800 mm

     

    Supply Requirements

    Voltage208-230-380-400-440-460-480VAC - 3~
    Frequency50 / 60 Hz
    Power rating9 kVA
    Compressed air5 - 10 bar
    Average air consumption6 m3/h at 6 bar
    Factory exhaust300 m3/h at 50 Hz

     

    Equipment Performance

    Uptime≥ 98%
    Max. throughputca. 250 Lf/h
    MTBF≥ 200 h for every MTTR of 1 h
    MTBA≥ 3 h
    MTTR≤ 1 h
    MTTA≤ 3 min

     

    Press and Mold Properties

    Max. clamp force600 kN
    Max. mold opening90 mm
    Max. transfer pressure180 bar
    Pellet diameter11, 14 or 14.3 mm
    Max. number of plungers10
    Max. cavity temperature difference± 2 ºC
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