Besi Datacon8800advanced 芯片焊接机
时间：2017-08-12 阅读：2098
Besi Datacon 8800 FC QUANTUM advanced 芯片焊接机
As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective Flip Chip system available today.
- Highest UPH up to 9000, including dip fluxing
- Full process and yield control
Proven 5µm accuracy
Unprecedented Speed
- Unique patent pending CRYSTAL concept (glass based fluxer with simultaneous inspection)
- Enhanced trajectories and motion control
- Highest speed with full process control
Full Yield Control
- Full Process & Production control
- Superior usability with enhanced Pseudo X-Ray
- Fast Post Bond Inspection
Proven production Accuracy
- 5µm accuracy at highest speed
- Lowest vibration with SMART path filtering
- Enhanced Matrix BMC test
Shortest Lead time
- 4 Weeks lead time
- Lean production process
- Aligned with proven Besi production process
Uniform QA system installed at contract manufacturers
| X/Y placement accuracy | ± 5 µm @ 3 sigma |
|---|---|
| Bond force | 200 g - 5,000 g |
| Die size | 0.4 mm – 30 mm (Fast CUC mode <12 mm only) |
| Die thickness | 0.02 mm – 7 mm |
| Wafer size | 4" – 12" (on 8" or 12" wafer frames) |
| Substrate types | FR4, ceramic, BGA, strip, flex, boat, leadframe |
| Working range | 13" x 12" |
| Flux film thickness | Various cavity plates available |
| Size | 1,600 mm x 1,200 mm x 1,450 mm (W x D x H) |
| Weight | 2,000 kg |
Substrate / Strip Handling
- Input/output buffer
- Magazine loader/unloader ML1
- Vision system
- RGB lighting
- OCR recognition for substrates
Software
- Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142)
- Pseudo X-Ray
- Flip and P&P Tool Inspection
- Needle Hole Inspection
- Eject Tool Needle Inspection
- Eject Tool Cap Inspection
- Ejection System Live Cam
- SECS GEM Parameter Provider
- Wafermap Verification by Border Component
- Configure User Level
- Advanced Flux Imprint Check
- Chipping Inspection
- Auto Illumination
- Distributed Bonding
- Single Component Tracking
- Lot Management