Besi Datacon 8800 芯片焊接机
时间：2017-08-12 阅读：3972
Besi Datacon 8800 FC QUANTUM sigma 芯片焊接机
The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership.
Key Features
Enhanced Accuracy, Higher Speed – Unbeatable Cost-of-Ownership for Flip Chip
- Exceptional accuracy of ± 5 µm @ 3 Sigma at highest speed
- Increased, higher productivity, highest yield
- Operator-independent quality by fully automatic machine calibration
High Flexibility – No Compromise for any Production Process
- Capability to handle any flip chip size
- No restriction on substrate type (leadframes, strips, panels, wafers up to 8")
- Ready for ultra thin die handling
High Reliability – Consistent Quality, Minimal Risk
- Field-proven, reliable machine concept and production process
- Matching the requirements of IDMs and subcons (90% market share)
Unbeatable benchmark for flip chip assembly equipment
| X/Y placement accuracy | ± 5 µm @ 3 sigma |
|---|---|
| Bond force | 200 g - 5,000 g (less wit Low Force Kit) |
| Die size | 0.4 mm – 30 mm |
| Die thickness | 0.02 mm – 7 mm |
| Wafer size | 4" – 12" (on 8" or 12" wafer frames) |
| Substrate types | FR4, ceramic, BGA, strip, flex, boat, leadframe |
| Working range | 13" x 12" |
| Flux film thickness | Various cavity plates available |
| Size | 1,600 mm x 1,200 mm x 1,450 mm (W x D x H) |
| Weight | 2,000 kg |
Substrate / Strip Handling
- Input/output buffer
- Magazine loader/unloader ML1
- Vision system
- RGB lighting
- OCR recognition for substrates
Software
- Wafer mapping host
- Substrate mapping