Besi Esec 2100 hS 芯片焊接机
时间：2017-08-12 阅读：2346
Besi Esec 2100 hS 芯片焊接机
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform concept won the prestigious Swiss Technology Award.
Key Features
Leading Edge Machine Concept
- Real time process monitoring through 4 live images of process zone
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Up Time
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Speed at 20 µm Accuracy
- Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements
- New "light&rigid" pick & place structure, advanced trajectory control as well as a liquid cooling system ensuring excellent accuracy at highest speed
- Placement accuracy down to 15 µm (3 sigma) using High Accuracy Mode
Fastest time to Yield
- Tool-less exchange of product specific parts for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
- Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
The Platform of the Future
- New controller hardware using Gigabit Ethernet communication enabling advanced processes
- Next generation platform ensuring upgrades and expansion of functionalities at any time
- Scalable performance & application range
| Bonding method | Epoxy |
|---|---|
| Cycle time | 120 ms with Liquid Cooling option |
| Bonding accuracy | 20 µm @ 3σ (15 µm option) |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames) |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm |
| Leadframe size | Length: 90 to 300 mm Width: 23 to 100 mm |
| Machine dimensions | 1785x 1448 x 1400 mm (W x D x H) |