Besi Esec 2100 xPplus 芯片焊接机
时间：2017-08-12 阅读：2043
Besi Esec 2100 xPplus 芯片焊接机
The Die Bonder Esec 2100 xPplus is the the 2nd generation of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.
Key Features
Leading Edge Machine Concept
- 3 fully decoupled process stations allow to handle any substrate up to 300 mm length without any restrictions
- Reloading of material from the front while machine is in full operation
- Key alignment tasks performed by cameras make many mechanical adjustments obsolete
Highest Up Time
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Speed at 15 µm Accuracy
- 167 ms pick & place cycle time due to the revolutionary Phi-Y mechanism combining rotational with linear movements
- Placement accuracy of 15 µm (3 sigma) through vibration control and High Accuracy Mode
- Highest stiffness for highest speed AND accuracy
Fastest Time to Yield
- Tool-less exchange of product specific parts for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
The Platform of the Future
- Handles all high-end epoxy processes on strip for substrate lengths up to 300 mm
- 50 N bond force standard
- Third process station enables easy adaptation to future leading-edge applications
| Bonding Method | Epoxy |
|---|---|
| Cycle time | 167 ms |
| Bonding accuracy | Down to 15 µm @ 3σ |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames) |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm |
| Leadframe size | Length: 90 mm to 300 mm Width: 9 mm to 84 mm |
| Machine dimensions | 1,785 x 1,448 x 1,400 mm (W x D x H) |
Substrate Handler
- Dual Input (MHIN and TOS)
- Magazine Handler Input (MHIN only)
- Rail Downholder
- Motorized Downholder Disp/Bond
- Strip Marking Unit
- Striphandler 84mm cold taped QFN
- Striphandler 84mm hot 1 zone
- Striphandler 84mm hot 1 zone flexible
- Striphandler 100mm hot 1 zone flexible
- SMEMA Link Input
- SMEMA Link Output
Dispenser
- PDS Epoxy Level Detection
- PDS Purge and Pre-Dispense Station
- Multi Dispense Process
Pick & Place
- Massflow Die Sensor
- Small Die Kit
- High Accuracy Mode
Vision
- Indirect Illumination (BVI/DVI)
- Dispense Vertical Indirect Illumination (DVIILL)
- Dispense Quality Check
- Bond Quality Check
- Bond Vertical Indirect Illumination (BVIILL)
Automation
- Wafer Mapping including Conversion
- Host Communication Interface
- E142 Strip Mapping (CSR required)
Miscellaneous
- Uninteruptible Power Supply to PC
- Ionizer Pick
- Ionizer Bond
- Ionizer Controlled Pick (IONC-P)
- Ionizer Controlled Bond (IONC-B)
- Ionizer Controlled Dispense (IONC-D)
- Ionizer Controlled WH Load Top (IONC-WT)
- Ionizer Controlled WH Load Bottom (IONC-WB)
- Ionizer Controlled Magazine Input (IONC-MHIN)
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor