Besi Datacon 2200 evo 粘片机

 

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.

Key Features

Specifications

Machine Capability

X/Y placement accuracy 

±10 µm @ 3 sigma (7 µm on request)

Heated bond head (optional) 

Up to 350 °C

Bond force

0 – 7,500 g (programmable)

Wafer

 Die size

Die attach 0.17 mm – 50 mm

Flip Chip 0.8 mm – 50 mm

 Die thickness

0.02 mm – 7 mm

 Wafer size

4" – 12"

Tape and Reel

Tape width

8 mm – 44 mm

Substrates and Carriers

Types

FR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak®, JEDEC tray

Working range

13" x 8"

Dispenser

Types

Pressure/time, Volumetric (Auger-screw type), High-performance D-style pump

Adhesive and Stamping Reservoir

Epoxy thickness

Setting range 0.1 mm – 5 mm (0.004" – 0.19")

Slide Fluxer

Flux film thickness 

Various cavity plates available

Size and Weight*

Size

W 1,200 mm x D 1,225 mm x H 2,000 mm

Weight

1,300 kg

*single module without input/output systems