Besi Datacon 2200 evo plus 粘片机

 

The Datacon 2200 evo^plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. 
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

Datacon 2200 evo goes PLUS!

• PLUS accuracy
• PLUS productivity
• PLUS flexibility
• Multi-chip capability
• Flexibility for customizing
• Open platform architecture

Performance

• X/Y placement accuracy: ± 7 µm @ 3s
• Theta placement accuracy: ± 0.15° @ 3s
   

UPH

• Die attach: up to 7,000 UPH/module
• Flip Chip with dipping up to 2,500 UPH/module
• Flip Chip without dipping up to 3,200 UPH/module
   

Bond Heads

• Standard bond head 0° - 360° rotation
• Heated bond head (optional)
   

Footprint

• LxDxH: 1,160 mm x 1,225 mm x 1,800 mm
   

Statistics

• Uptime > 98 %
• Yield > 99.95 %
   

Wafer

• Die size Die Attach: 0.17 mm - 50 mm
• Die size Flip Chip: 0.5 mm - 50 mm
• Die thickness: 0.05 mm - 7 mm
• Wafer size: 2" - 12" (50 mm - 300 mm)
• Frame size: 5" - 15" (125 mm - 375 mm)
   

Chip Trays

• Waffle pack / Gel-Pak® 2” x 2” and  4” x 4”
• JEDEC tray on request
   

Substrates and Carriers

• FR4, ceramic, BGA, flex, boat, lead frame, waffle pack
• Gel-Pak®, JEDEC tray, odd-shape substrates
• Substrate working range: 13” x 8”(325 mm x 200 mm)
   

Options

• Hardware: Open platform architecture for full customization
• Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition, and more.