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BesiFicoAMS-W芯片成型系统

时间:2017-08-12      阅读:433

Besi Fico AMS-W 芯片成型系

 

The Fico AMS-W is the most economic and flexible MAP molding system, dedicated to the latest trend in single sided packaging. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi-chip array and stacked die.

More information?

Curious of what the Fico AMS-W can do for you? Contact the Besi sales department for more information.

Key Features

  • Clean room class 1000
  • Topedge gating
  • 45 tons press station
  • Transfer pressure control
  • Cavity vacuum control
  • Adaptive clamping
  • Semi S2/S8 compliant
  • Unwanted object detection in the press to prevent damage
  • Remaining cull detection when molded products are unloaded
  • Leadframe orientation check with automatic correction
  • Remote pellet feed with pellet length check
  • Product & lot tracking
  • Large cull bin, can be emptied while the machine continues production
  • User friendly touch screen with all machine manuals
  • Clean room class 1000 compatible

CE compliant

Width2,272 mm
Depth1,490 mm
Height1,976 mm
WeightApprox. 2,600 kg

 

Leadframe Dimensions

Width45 - 78 mm
Length180 - 280 mm
Thickness0.1 - 1.5 mm
HeightMax. 2 mm

 

Cassette Dimensions

Width48 - 85 mm
Length180 - 300 mm
Height100 - 165 mm
Storage capacity400 mm

 

Supply Requirements

Voltage208-230-380-400-440-460-480VAC - 3~
Frequency50 / 60 Hz
Power rating9 kVA
Compressed air5 - 10 bar
Average air consumption6 m3/h at 6 bar
Factory exhaust300 m3/h at 50 Hz

 

Equipment Performance

Up time≥ 98%
Max. throughputca. 250 Lf/h
MTBF≥ 200 h for every MTTR of 1 h
MTBA≥ 3 h
MTTR≤ 1 h
MTTA≤ 3 min
Mold open time16 sec

 

Press and Mold Properties

Max. clamp force450 kN
Max. mold opening90 mm
Max. transfer pressure180 bar
Pellet diameter11, 14 or 14.3 mm
Max. pellet length45 mm
Max. number of plungers10
Max. cavity temperature difference± 2 ºC

The Fico AMS-W can be supplied in a variety of configurations according to your requirements. These configurations can include:

  • SECS/GEM
  • Thin Substrate handling
  • Side rail vacuum
  • V-pin mold
  • High end vacuum
  • Also available as manual machine
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