BesiEsec2100FChS倒装芯片键合机
时间：2017-08-12 阅读：756
Besi Esec 2100 FC hS 倒装芯片键合机
The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED. It is the most effortless system to run, assist and control production, resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
Key Features
Highest Speed at 10 µm Accuracy
- Up to 10k UPH including dip fluxing
- Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements
- New "light&rigid" pick & place structure, advanced trajectory control as well as a liquid cooling system ensuring excellent accuracy at highest speed
Leading Edge Machine Concept
- Real time process monitoring through 4 live images of process zone
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Up Time
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Fastest time to Yield
- Tool-less exchange of product specific parts for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
The Platform of the Future
- New controller hardware using Gigabit Ethernet communication enabling advanced processes
- Next generation platform ensuring upgrades and expansion of functionalities at any time
Scalable performance & application range
| Bonding method | Flip Chip |
|---|---|
| Bonding accuracy | 10 μm @3s |
| Min. cycle time | 240 ms (incl. dip fluxing) |
| Wafer size | 4” to 12” |
| Frame size | 6", 8” and 12” |
| Die size | 0.3 (with small die kit) to 20 mm |
| Die thickness | ≥ 0.1 mm / ≥ 4mils (thinner on request) |
| Strip dimensions | Length up to 500 mm Width up to 125 mm (flat boats up to 137 mm) |
| Machine dimensions | 1430 x 1440 x 1400 mm (W x D x H) |
| Weight | Approx. 1,400 kg / 3,000 lb |
Substrate Handler
- Strip Handler 75 mm cold rail
- Strip Handler 125 mm cold rail
- Active-Z Handler 137 mm cold (STH137-AZ)
- Top Stack Loader (TOS)
- Dual Input (MHIN and TOS)
- Magazine Handler Input (MHIN only)
- Magazine Handler Output (MHOUT)
- Rail Downholder
- Motorized Downholder Disp/Bond
- Strip Marking Unit
- SMEMA Link Input
- SMEMA Link Output
Slide Fluxer
- Duplex Slide Fluxer 2
Dispenser
- PDS Epoxy Level Detection
- PDS Purge and Pre-Dispense Station
- Multi Dispense Process
Die Ejector
- Die Ejector with Motorized X and Y Axis
- Ultra Thin Die Needle Module
Pick & Place
- Massflow Die Sensor
Vision
- Pre Align Vision (PAV)
- Dispense Vertical Indirect Illumination (DVIILL)
- Bond Vertical Indirect Illumination (BVIILL)
- Dispense Quality Check
- Bond Quality Check
- Pseudo X-ray
- Smart EVI Speed-Up
Automation
- Host communication interface
- Wafer mapping incl. map conversion
- E142 strip mapping
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer Pick
- Ionizer Bond
- Ionizer Controlled Pick (IONC-P)
- Ionizer Controlled Bond (IONC-B)
- Ionizer Controlled Dispense (IONC-D)
- Ionizer Controlled WH Load Top (IONC-WT)
- Ionizer Controlled WH Load Bottom (IONC-WB)
- Ionizer Controlled Magazine Input (IONC-MHIN)
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
- Mini System for training