Besi Fico AMS-WTopFoil芯片成型系统
时间：2017-08-12 阅读：667
Besi Fico AMS-W Top Foil 芯片成型系统
The Fico AMS-W for top foil is an automatic molding system for single sided MAP products like BGA, QFN and BOC. The unique top foil feature on this machine allows bleed free production of bare die products. A special foil, guided over the top mold creates a soft sealing layer between mold and products. As a result, the die stays clear of compound. The use of top foil eliminates an extra cleaning process step after molding.
More information?
Curious of what the Fico AMS-W with Top Foil can do for you? Contact the Besi sales department for more information.
Key Features
- Top edge molding
- 45 tons press station
- Cavity vacuum control
- Board vacuum
- Dynamic clamping control
- Transfer pressure control
- Dynamic temperature control
- Easy mold exchange
- Compound reduction
- Small footprint (up to 50% smaller)
Machine Dimensions
| Width | 2,273 mm |
|---|---|
| Depth | 1,490 mm |
| Height | 1,976 mm |
| Weight | Approx. 2,600 kg |
Leadframe Dimensions
| Width | 45 - 78 mm |
|---|---|
| Length | 180 - 280 mm |
| Thickness | 0.1 - 1.5 mm |
| Height | Max. 2 mm |
Cassette Dimensions
| Width | 48 - 85 mm |
|---|---|
| Length | 180 - 300 mm |
| Height | 100 - 165 mm |
| Storage capacity | 400 mm |
Supply Requirements
| Voltage | 208-230-380-400-440-460-480VAC - 3~ |
|---|---|
| Frequency | 50 / 60 Hz |
| Power rating | 9 kVA |
| Compressed air | 5 - 10 bar |
| Average air consumption | 6 m3/h at 6 bar |
| Factory exhaust | 300 m3/h at 50 Hz |
Equipment Performance
| Uptime | ≥ 98% |
|---|---|
| MTBF | ≥ 200 h for every MTTR of 1 h |
| MTBA | ≥ 3 h |
| MTTR | ≤ 1 h |
| MTTA | ≤ 3 min |
Press and Mold Properties
| Max. clamp force | 450 kN |
|---|---|
| Max. mold opening | 90 mm |
| Pellet diameter | 11, 14 or 14.3 mm |
| Max. pellet length | 45 mm |
| Max. number of plungers | 10 |
| Max. cavity temperature difference | ± 2 ºC |
The Fico AMS-W Top Foil can be supplied in a variety of configurations according to your requirements. These configurations can include:
- SECS/GEM
- Thin substrate handling
- Side rail vacuum
- V-pin mold
- High end vacuum
- Also available as manual machine