Besi Esec 2100 FC plus 芯片焊接机
时间：2017-08-12 阅读：2383
Besi Esec 2100 FC plus 芯片焊接机
Besi Switzerland as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Besi Switzerland’s response to driving down the cost of flip chip technology.
Highest UPH – No Time Wasted
- Simultaneous movement of chip and camera – no time wasted for image taking
- Low vibrations – no time wasted for motion settling
- Innovative parallel activity machine design with Phi-Y movement pick-and-place
- Focused on strip based products
Load & Run – Shortest Time to Yield
- Load recipe from host and run on any machine
- Full recipe transfer from machine to machine
- Operator independent results ensured by auto calibration
Highest Up Time – Consistent Quality
- Reliable and accurate flip chip process
- Smart and safe wafer mapping
2100 Platform Synergies – Reduced Operating Cost
- One compact flip module is all that makes the difference to epoxy die bonders of the 2100 platform
- Most spare parts are the same – lean stock and high availability
- Flexible workforce – cross-trained operators and support teams
| Bonding method | Flip Chip |
|---|---|
| Bonding accuracy | Down to 10 μm (3σ) |
| Min. cycle time | 400 ms |
| Wafer size | 4” to 12” |
| Frame size | 6", 8” and 12” |
| Die size | 0.5 … 20 mm / 20 mils … 0.8 inch |
| Die thickness | ≥ 0.1 mm / ≥ 4mils (thinner on request) |
| Strip dimensions | Length up to 500 mm Width up to 125 mm (flat boats up to 137 mm) |
| Machine dimensions | 1430 x 1440 x 1400 mm (W x D x H) |
| Weight | Approx. 1,400 kg / 3,000 lb |
Substrate Handler
- Active-Z Handler 137 mm cold (STH137-AZ)
- Strip Handler 84 mm Flip Chip
- Software to Run STH84-FC with Higher Speed
- Advanced UPH
- Dual Input (MHIN and TOS)
- Magazine Handler Input (MHIN only)
- Rail Downholder
- Motorized Downholder Disp/Bond
- Strip Marking Unit
- SMEMA Link Input
- SMEMA Link Output
Slide Fluxer
- Duplex Slide Fluxer
Dispenser
- PDS Epoxy Level Detection
- PDS Purge and Pre-Dispense Station
- Multi Dispense Process
Die Ejector
- Die Ejector with Motorized X and Y Axis
- Ultra Thin Die Needle Module
Vision
- Dispense Vertical Indirect Illumination (DVIILL)
- Bond Vertical Indirect Illumination (BVIILL)
- Dispense Quality Check
- Bond Quality Check
- Pseudo X-ray
Automation
- Host communication interface
- Wafer mapping incl. map conversion
- E142 strip mapping
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer Pick
- Ionizer Bond
- Ionizer Controlled Pick (IONC-P)
- Ionizer Controlled Bond (IONC-B)
- Ionizer Controlled Dispense (IONC-D)
- Ionizer Controlled WH Load Top (IONC-WT)
- Ionizer Controlled WH Load Bottom (IONC-WB)
- Ionizer Controlled Magazine Input (IONC-MHIN)
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
- Mini System for training