Besi Datacon 8800 CHAMEO advanced 芯片焊接机

 

Highest Productivity for FO-WLP

As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.

The Datacon 8800 CHAMEO ^advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs.

Key Features

Multi-Chip – Combining Speed, Flexibility and Accuracy

• Multi-chip capability – Flexibility on smallest footprint
• Single pass is king – Improve your Cpk for multi-FC packages
• Waffle pack feeders – Extend your possibilities
• Extra Speed up to +40%

Enhanced Capabilities – Ready for the Future

• Thermo-compression – No limits for your applications
• Leadframe, strip, boat, wafer – No limits for your substrates
• Customized features – Exactly tailored for your process
• 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
• Face-down & Face-up (recipe controlled)
• Clean room class ISO 5
• Foup load port
• Tape & Reel

Highest Accuracy – Capturing Tomorrow’s Markets

• Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma – For fine-pitch and TSV applications
• Local reflow – Mastering sophisticated assemblies
• Long-term stability – Securing high yield at high speed 
   

Wafer Level Applications

• Fan-Out Wafer Level Packages – Highest performance for lowest cost
• Advanced Chip to Wafer – Cost effective dual die stacking
• Through Silicon Vias (TSV) – Entry ticket to the future