Besi Esec 2100 SC 芯片焊接机

 

The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.

Key features

Leading Edge Machine Concept

• Single clamp transport system
• 100% post bond QC inspection at high speed 
• Key alignment tasks performed by cameras make many mechanical adjustments obsolete
• Optional 3 zone heating for pre-curing (accuracy) and void control (dehumidification)
   

Highest Up Time

•  Real time process monitoring through 4 live images of process zones
• Constant status control with real time wafer, tape and magazine viewer
• Efficient learning and error recovery thanks to context sensitive online help
   

Highest Speed at 25 µm Accuracy

• Phi-Y Pick and Place with symmetrical design for short settling time resulting in highest UPH 
• Best placement accuracy through vibration control
• Highest stiffness for highest speed AND accuracy
   

Fastest Time to Yield

• Tool-less exchange of product and easy loading of material for fastest product changeovers
• Teach and setup wizards and parameter teach verification eliminate setup errors
• Recipe transfer from machine to machine enables fast conversion
   

The Platform of the Future

• 3rd generation pick and place
• 50 N bond force standard
• Third process station enables easy adaptation to future leading-edge applications
   

  Bonding method	Epoxy
  Bonding accuracy	Down to 25 µm @ 3σ
  Wafer size	4" to 12" (on 8" or 12" wafer frames)
  Die size	0.5 mm to 20 mm
  Tape size	Width: 35 mm
  Machine dimensions	3040 x 1448 x 1680 mm (W x D x H)

Section "Tape Handler"

• Tape Handler 35mm hot (TPH35h)
• Tape Input Handler (TIH)
• Tape Output Handler (TOH)
• Tape Input Buffer (TIB)
• Tape Output Handler Simplified (TOHS)
• Tape Output Handler Detached (TOHD)
• Tape Output Handler Detached Simplified (TOHDS)
   

Dispenser

• PDS Epoxy Level Detection
• PDS Purge and Pre-Dispense Station
   

Pick & Place

• Massflow Die Sensor
• Small Die Kit
   

Vision

• Indirect Illumination (BVI/DVI)
• Dispense Vertical Indirect Illumination (DVIILL)
• Dispense Quality Check
• Bond Quality Check
• Bond Vertical Indirect Illumination (BVIILL)
• Pick Indirect Illumination (PIILL) - CSR required
   

Curing

• Compact Curing
• Compact Curing, integrated Exhaust
• Curing Oven
• Curing Oven with Rail
   

Automation

• Wafer Mapping including Conversion
• Host Communication Interface
   

Miscellaneous