Besi Datacon 2200 evo hS 粘片机
时间：2017-08-12 阅读：2465
Besi Datacon 2200 evo hS 粘片机
Innovative Solution for Innovative Products
The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.
Datacon 2200 evo goes hS!
- Multi-chip capability
- Flexibility for customizing
- Open platform architecture
Key Features
Multi-chip
- Fully automatic cycle for Multi-chip production
- Up to 7 Pick & Place tools (optionally 14), 5 eject tools
- Pressure/time (Musashi®), Auger, Jetter type dispensers available
- Epoxy stamping option
- Filled and unfilled epoxy, wide viscosity range
Accuracy
- New high-speed image processing unit
- Full alignment & Bad mark search
- Pre-defined fiducial geometry & customized teaching
Pick & Place Head
- Die Attach, Flip Chip and Multi-Chip in one machine
- Die pick from: wafer, waffle pack, Gel-Pak®, feeder
- Die place to: substrate, boat, carrier, PCB, leadframe, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
Accuracy
| X/Y placement accuracy | ±7 µm @ 3 sigma |
|---|---|
| Theta placement accuracy | ± 0.15° @ 3s |
Bond Heads
| Standard bond head | 0° - 360° rotation |
|---|---|
| Heated bond head | option |
Dimensions
| Footprint | 1,160 x 1,225 x 1,800 mm (DxH) |
|---|---|
| Weight | 1,450 kg |
Performance
| Uptime | > 98% |
|---|---|
| Yield | > 99.95% |
| Output | up to 12,000 UPH |
Wafer
| Die size | Die attach 0.17 - 5 mm |
|---|---|
| Die thickness | 0.05 - 2 mm |
| Wafer size | 2 - 12" (50 - 300 mm) |
| Frame size | 5 - 15" (125 - 375 mm) |
Chip trays
| Waffle pack / Gel pack | 2 x 2" and 4 x 4" |
|---|---|
| Jedec | On request |
Substrate & Carriers
| Types | FR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak®, JEDEC tray, odd-shape substrates |
|---|---|
| Working range | 13 x 8" (325 x 200 mm) |
Options
| Hardware | Open platform architecture for full customization |
|---|---|
| Software | Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more |