功能：贴片应用：倒装焊

特点：

•   Correspond to fine pitch of electrodes with mounting accuracy  ± 1μm

•   Correspond yo ultra-low load（0.049N）to high load (490N）without head replacement

•   follows thermal variation of work and tools in real time

•   Equipped with recipes for various bonding processes as standard

•   Feedback of abnormalities by bonding log analysis

Standard Items & Optional Items

＜Standard Items＞

• Flip chip unit

• Constant heat stage

• ATC（ Automatic ceramic tool change )

• Calibration

• Process management (logger / export to another PC)

• Automatic leveling mechanism

•  

＜Optional Items＞

• Eutectic head ( No heating )

• Eutectic purge jig

• Eutectic stage(□52mm pulse heater

• Transfer function( Flux, Paste)

• Dispenser unit( except dispenser)

• Die bonding

• Chip imaging camera

• Gel pack

• Ultrasonic bonding

• ID Reading

项目

规格参数