功能：贴片应用：倒装焊

特点：

• Ultra-low load, high-accuracy bonding

• Real-time control is possible in the low load range. As a result, bump height variation become minimized.

• Supports ultrasonic bonding by exchanging tools

• Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder

Standard Item & Optional Items 

[Standard Items]

• Flip chip unit

• Constant heat stage

• ATC（Automatic ceramic tool change)

• Calibration

• Process management(logger/export to another PC)

• Automatic leveling mechanism

• ID Reading

＜Optional Items＞

• Eutectic head ( No heating)

• Eutectic purge jig

• Eutectic stage (52mm pulse heater)

• Transfer function( Flux, Paste)

• Dispenser unit (except dispenser)

• Die bonding

• Chip imaging camera

• Gel pack

• Ultrasonic bonding

项目

规格参数