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Helios 5 Laser PFIB System

型号
赛默飞电子显微镜

高级会员2年 

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扫描电子显微镜,双束电镜,透射电子显微镜,冷冻电镜,X射线光电子能谱仪,三维可视化软件
FEI公司,2016年被赛默飞世尔科技收购,成为赛默飞材料与结构分析(MSD) 电镜事业部,是显微镜和微量分析解决方案的创新者和供应商。 我们提供扫描电子显微镜SEM,透射电子显微镜TEM和双束-扫描电子显微镜DualBeam FIB-SEM,结合先进的软件套件,运用广泛的样本类型,通过将高分辨率成像与物理、元素、化学和电学分析相结合,使客户的问题变成有效可用的数据。

详细信息

Helios 5 Laser PFIB System

FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution

The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Key Features


Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.

Specifications

Femtosecond-laser specifications
Laser integration
  • Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.

Laser Output
First Harmonic
  • Wavelength

1030 nm (IR)


  • Pulse duration

<280 fs

Second Harmonic
  • Wavelength

515 nm (green)


  • Pulse duration

<300 fs

Optics
Coincident point
  • Working distance= 4 mm (Same as SEM/FIB)

Objective lens
  • Variable (motorized)

Polarization
  • Horizontal/vertical

Repetition rate
  • 1 kHz – 1 MHz

Position accuracy
  • <250 nm

Protective shutter
  • Automated SEM/PFIB protective shutter

Software
  • Laser control software

  • Laser 3D serial sectioning workflow

  • Laser 3D serial sectioning workflow with EBSD

  • Laser scripting with optional Thermo Scientific AutoScript 4 Software

Safety
  • Interlocked laser enclosure (Class 1 laser safety)


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